Övriga specifikationer
- Features
- CPU socket Type TDP Material Thermal paste | Intel socket LGA4677 1U Passive up to 205 Watt Copper with VC base Shin-Etsu 7762 Pre-printed
- Description
- Passive 1U cooler for Intel® socket LGA 4677
- Logistic Data
- Dimension Net weight Gros weight Article number GTIN Packing unit | 118 x 78 x 27 mm 0.460 kgs 0.515 kgs 88885613 0859300007833 1 pcs | 12 pcs (carton)
- Scope of delivery
- Cooler | E1B Package carrier
- Environmental Temperature
- -10°C - 65°C (Operating) | -30°C - 70°C (Storage)