- Features
- CPU socket Type TDP Material Thermal paste | Intel socket LGA4677 1U Active up to 205 Watt Copper with VC base Shin-Etsu 7762 Pre-printed
- Description
- Active 1U cooler for Intel® Sockel LGA 4677
- Logistic Data
- Dimension Net weight Gros weight Article number GTIN Packing unit | 118 x 80 x 27 mm 0.455 kgs 0.510 kgs 88885610 0859300007826 1 pcs | 12 pcs (carton)
- Technical Data
- Fan size Bearing Voltage Power | Fan speed | Air Flow Air pressure | Noise level | 80 x 13 mm Double ball 12V at 20%: 1.08 W | at 50%: 4.7 W | at 100%: 23.45 W at 0~20%: 2000 ± 200 rpm | at 50%: 4900 ± 10% rpm | at 100%: 8600 ± 10% rpm at 20%: 5.59 cfm | at 50%: 14.76 cfm | at 100%: 26.25 cfm bei 20%: 3.69 mm-H2O | bei 50%: 25.28 mm-H2O | bei 100%: 89.80 mm-H2O bei 20%: 23.3 dBA | bei 50%: 43.5 dBA | bei 100%: 62.2 dBA
- Scope of delivery
- Cooler | E1B Package carrier
- Environmental Temperature
- -10°C - 65°C (Operating) | -30°C - 70°C (Storage)